Multiphysics Fusion™ solutions for customer deployment. As chip complexity increases, physics-related challenges including ...

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of ...

The engineers and researchers highlighted in COMSOL News 2026 use COMSOL Multiphysics® to meet their development goals, push ...

Synopsys ( SNPS) announced on June 17 the launch of its new Multiphysics Fusion platform, combining its AI-powered chip ...

Synopsys' first multiphysics fusion solutions bring together electronic design automation (EDA) tools and multiphysics analysis capabilities to address the growing challenges of advanced semiconductor ...

Synopsys has released its first Multiphysics Fusion solutions, integrating Ansys golden signoff analysis directly into chip ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...

BURLINGTON, Mass., Nov. 18, 2025 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, today announced the release of COMSOL Multiphysics® version 6.4, which introduces new ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...